Metalized CERAMIC
AMB DPC DBC
AMB — Active Metal Brazed
DPC — Direct Plated Copper
DBC — Direct Bonded Copper
Csutomizable Ceramic metal process for different application.
Please refer to the table for detailed specifications
Drag left or right to view the table
Parameter
Specification
Unit
Size
138*190 ( Useable Area Min:15*15 / Max: 127*178)
mm2
Peel strength
>5
N/mm
Surface weldability
≥ 95% wetting
Wire bonding performance
Shearing strength≥1000gf Aluminium Residue after shearing≥50%
Dielectric strength performance
Front to back Leakage Current< 1.5
mA
TC Cycle
AMB DBC DPC
View Other Products
Monocrystalline & Polycrystalline
Single-crystal(MONO) and polycrystalline diamond are emerging as critical materials in the semiconductor industry due to their exceptional thermal conductivity, electrical insulation, and mechanical hardness.
Single-crystal diamond, with its superior crystal quality and ultra-high thermal conductivity, is ideal for high-frequency, high-power applications such as next-generation RF devices, microwave communications, and quantum computing components.
Polycrystalline diamond, being more cost-effective and suitable for large-area deposition, is widely used in thermal management substrates and packaging, especially in electric vehicles, 5G infrastructure, and high-performance computing systems.
Silicon Nitride
Wildly use Circuit substrate, heat spreader.
Power module for automobile, IGBT,
EV Power Module
Metalized processing:
Thin film, Thick film, DPC, DBC, AMB
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